Main features: shock absorption, filling, insulation, cooling temperature -60 ℃ - 250 ℃
Applications: Power Devices (power supplies, calculators, telecommunications), automotive electronic module (engine Cashi), power module, the mainframe computer (CPU, GPU, USICS, hard drives), CDROM, as well as any need to fill and Thermal place
Specifications: according to the processing requirements of the guests
Width: conventional: 0.23 mm (thinnest 0.20 mm, the thick 1.0 mm)
